Electroless and other nonelectrolytic plating techniques recent developments by J. I. Duffy

Cover of: Electroless and other nonelectrolytic plating techniques | J. I. Duffy

Published by Noyes Data Corp in Park Ridge, N.J .

Written in English

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  • Electroless plating -- Patents.

Edition Notes

Supplement to "Electroless plating and coating of metals" by John McDermott.

Book details

Statementedited by J.I. Duffy.
SeriesChemical technology review -- no.171
ContributionsMcDermott, John.
LC ClassificationsTS662
ID Numbers
Open LibraryOL22488564M
ISBN 100815508182

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ISBN: OCLC Number: Notes: Supplement to John McDermott's [i.e. M.W. Ranney's] Electroless plating and coating of metals,   Purchase Electroless Plating - 1st Edition.

Print Book & E-Book. ISBNBook Edition: 1. Automatic semiconductor wafer plating system for up to 5 wafers. mm, mm and mm wafers are plated with ENiPIG process. Fully robotic transfer include Author: Wet Process by SPEC. DIY Brick Rocket Stove - Cooking Without Power - Duration: Live Simple, Live Free - Tinyhouse Prepper Recommended for you.

The electroless copper deposition process developed in this study may open up a new route of plating on plastics (POP) for printed circuit boards, electromagnetic interference shielding, and. Electroless Plating – Its Applications in Resistor Technology Article (PDF Available) in Electrocomponent Science and Technology 3(2) September .

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